Features of thermal potting adhesive
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Features of thermal potting adhesive
Thermally conductive encapsulant has excellent thermal conductivity and flame retardancy, low viscosity, good leveling, good self-defoaming, and easy operation during use. At the same time, it has excellent high temperature resistance, and can be used at -50 β ~ 200 β after curing; excellent electrical insulation performance, resistance to arc corona and impact, long-term protection of electrical components; good water resistance, ozone resistance, excellent The anti-aging performance can effectively prevent the infiltration of water vapor and maintain long-term sealing performance; excellent thermal conductivity can ensure the effective heat dissipation of electronic components.
