Definition and classification of potting glue

Encapsulants are also widely known as electronic adhesives and electronic encapsulants. They are mainly used for bonding, sealing, potting and coating protection of electronic components. Before being cured, the potting glue is liquid and has fluidity. The viscosity of the glue liquid varies according to the material, performance, pouring equipment and production process of the product. The potting glue needs to be completely cured to realize its use value. After curing, it can play the role of waterproof, moisture-proof, dust-proof, insulation, heat conduction, confidentiality, anti-corrosion, temperature resistance, and shock resistance.

There are many types of electronic encapsulants. According to the types of materials, the three most commonly used at present are mainly epoxy resin encapsulants, silicone resin encapsulants, and polyurethane encapsulants. These three materials Potting glue can be subdivided into hundreds of different products. Long-term effective protection of sensitive circuits and electronic components is undoubtedly playing an increasingly important role in today's sophisticated and demanding electronic applications. Silicone potting materials are undoubtedly one of the best choices. Silicone potting material has stable dielectric insulation and is an effective protection against environmental pollution. At the same time, it can eliminate the stress caused by shock and vibration in a large temperature and humidity range. Based on condensation system and addition curing system, there is no need for secondary curing, which can meet the special requirements of adhesion, thermal conductivity, flame retardant, high transparency, etc. After curing, a flexible elastomer is formed; The degree of airtightness is irrelevant.


 


Encapsulation is the mechanical or manual filling of liquid composites into devices containing electronic components and circuits, and curing at room temperature or under heating conditions into thermosetting polymer insulation materials with excellent performance. Its role is to strengthen the integrity of electronic devices and improve resistance to external shocks and vibrations; improve the internal component and line insulation, which is conducive to device miniaturization and light weight; avoid direct exposure of components and lines, and improve the waterproofing of devices And moisture resistance. Organic silicon encapsulants have a wide range of applications, technical requirements vary widely, and there are many varieties. There are two types of curing conditions: room temperature curing and baking curing.


 


Encapsulation is the mechanical or manual filling of liquid composites into devices containing electronic components and circuits, and curing at room temperature or under heating conditions into thermosetting polymer insulation materials with excellent performance. Its role is to strengthen the integrity of electronic devices and improve resistance to external shocks and vibrations; improve the internal component and line insulation, which is conducive to device miniaturization and light weight; avoid direct exposure of components and lines, and improve the waterproofing of devices And moisture resistance. Organic silicon encapsulants have a wide range of applications, technical requirements vary widely, and there are many varieties. There are two types of curing conditions: room temperature curing and baking curing.