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IOTA LSR 3100G is an addition-cured RTV-2 liquid silicone rubber developed for electronic potting, encapsulation, coating and protection.
The material consists of two components, Part A and Part B, which are mixed at a 1:1 ratio by weight or volume.
After mixing, the liquid silicone cures into a flexible silicone rubber that protects electronic components from environmental exposure.
Typical applications include:
Electronic components
Electrical assemblies
Sensors
Control modules
Power electronics
Battery and BMS components
Outdoor electronic equipment
Electronic assemblies requiring moisture and vibration protection
The IOTA LSR 3100G series combines low-viscosity processing with electrical insulation, thermal resistance and environmental protection.
Typical series-level specifications include:
| Property | Typical Value |
|---|---|
| Cure Type | Addition Cured |
| Components | Two-component RTV-2 |
| Mixing Ratio | 1:1 |
| Viscosity | 1,000–2,000 mPa·s |
| Working Time | 35–60 minutes |
| Curing Time | 4–10 hours |
| Hardness | Shore A 25–40 |
| Volume Resistivity | ≥10¹⁴ Ω·cm |
| Breakdown Voltage | ≥20 kV/mm |
| Dielectric Constant | 2.7–3.3 |
| Dielectric Loss | ≤0.02 |
| Operating Temperature | -50°C to 250°C |
| Thermal Conductivity | ≥0.3–0.8 W/m·K |
| Waterproof Level | Up to IPX6 depending on model |
| Flammability Rating | UL94-V0, UL94-V1 or UL94-HB depending on model |
Typical values vary according to the specific 3100G series grade. Product selection should be based on the complete technical specification and application requirements.
Addition-cured silicone is suitable for electronic encapsulation when stable electrical insulation, environmental protection and controlled curing performance are required.
The addition-cured system uses a two-component platinum-catalyzed curing mechanism and is designed to cure without the typical condensation-cure byproducts.
This characteristic can be useful for sensitive electronic assemblies where minimizing chemical byproducts during curing is important.
The cured silicone provides a flexible protective layer around electronic components and can help reduce exposure to:
Moisture
Dust
Vibration
Mechanical shock
Ozone
Chemicals
Temperature cycling
The 3100G series is available in different colors, viscosities, hardness levels and thermal conductivity grades.
| Model | Color | Viscosity | Hardness | Thermal Conductivity | Waterproof Level |
|---|---|---|---|---|---|
| 3101G | White | 2,000±500 mPa·s | Shore A 40±5 | ≥0.8 W/m·K | IPX6 |
| 3102G | Black | 2,000±500 mPa·s | Shore A 40±5 | ≥0.8 W/m·K | IPX6 |
| 3103G | Grey | 2,000±500 mPa·s | Shore A 40±5 | ≥0.8 W/m·K | IPX6 |
| 3100G | Transparent | 1,000–1,500 mPa·s | Shore A 25–30 | ≥0.3 W/m·K | IPX4 |
3101G is a white addition-cured silicone encapsulant with a viscosity of approximately 2,000±500 mPa·s and a hardness of approximately Shore A 40±5.
It is suitable for electronic assemblies where white-colored encapsulation and thermal conductivity of ≥0.8 W/m·K are required.
3102G provides the same general processing and electrical performance range as 3101G while using a black appearance.
The black formulation can be selected when visual coverage of electronic components is required.
3103G is the grey formulation of the series.
It provides approximately 2,000±500 mPa·s viscosity, Shore A 40±5 hardness and thermal conductivity of ≥0.8 W/m·K.
3100G is the transparent formulation.
Its viscosity is approximately 1,000–1,500 mPa·s, lower than the colored 3100G series grades, and its cured hardness is approximately Shore A 25–30.
This formulation can be considered when transparency, lower viscosity and a softer encapsulation material are important.
IOTA LSR 3100G is designed to provide electrical insulation for electronic components and assemblies.
The listed electrical properties include:
Volume resistivity: ≥10¹⁴ Ω·cm
Breakdown voltage: ≥20 kV/mm
Dielectric constant: 2.7–3.3
Dielectric loss: ≤0.02
These properties allow the material to be used as a protective insulating encapsulant for electronic and electrical assemblies.
Actual electrical performance should be evaluated using the final cured thickness, component geometry, operating voltage and environmental conditions of the application.
The listed operating temperature range of the IOTA LSR 3100G series is -50°C to 250°C.
This broad temperature range allows the material to be considered for electronic assemblies exposed to both low and high temperatures.
Potential applications include electronic equipment operating in outdoor environments, automotive systems, power electronics and other assemblies exposed to temperature variation.
For critical applications, the actual long-term operating temperature and thermal cycling conditions should be evaluated before production.
The colored 3100G series grades provide a listed thermal conductivity of ≥0.8 W/m·K, while transparent 3100G provides ≥0.3 W/m·K.
This difference is important when selecting a material for electronic encapsulation.
For applications where heat transfer from electronic components is important, 3101G, 3102G or 3103G may be considered based on the required formulation and application conditions.
For applications where transparency and lower viscosity are more important than thermal conductivity, transparent 3100G provides a different material option.
Thermal performance depends on the actual component design, encapsulation thickness and heat-transfer path.
The IOTA LSR 3100G series provides different waterproof levels depending on the formulation.
The listed waterproof ratings include:
IPX6: 3101G, 3102G and 3103G
IPX4: transparent 3100G
The cured silicone encapsulant helps isolate electronic components from moisture and other environmental exposure.
The appropriate grade should therefore be selected according to the required waterproof level and the actual enclosure design.
Keep Part A and Part B properly mixed and homogeneous before dispensing.
Mix Part A and Part B at a 1:1 ratio by weight or volume.
Thoroughly mix the two components and scrape the sides and bottom of the mixing container to achieve uniformity.
Vacuum degassing can be used to remove entrapped air after mixing.
This step is particularly useful for applications requiring bubble-free encapsulation and consistent electrical insulation.
Pour the mixed silicone into the lowest point of the encapsulation area and allow the material to flow naturally around the electronic components.
For higher-volume manufacturing, automated dispensing equipment can be used to improve mixing and dispensing consistency.
The typical curing time is approximately 4–10 hours, depending on the specific grade and curing conditions.
Curing speed is affected by temperature and other processing conditions.
Before mass production, the actual curing time should be verified using the customer's component geometry, dispensing volume and production environment.
When selecting an electronic potting silicone, the curing chemistry should be considered together with processing requirements.
| Feature | IOTA LSR 3100G | Condensation-Cured Silicone |
|---|---|---|
| Cure Type | Addition cured | Condensation cured |
| Mixing Ratio | 1:1 | Typically 10:1 |
| Typical Processing | Electronic potting and encapsulation | Electronic potting and encapsulation |
| Curing Byproducts | Designed to cure without typical condensation byproducts | Condensation reaction produces byproducts |
| Electrical Insulation | ≥10¹⁴ Ω·cm | Depends on grade |
| Breakdown Voltage | ≥20 kV/mm | Depends on grade |
| Temperature Range | -50°C to 250°C | Depends on grade |
| Viscosity | Approximately 1,000–2,000 mPa·s | Depends on grade |
The choice between addition-cured and condensation-cured silicone should be based on the required curing chemistry, processing conditions, component compatibility, electrical requirements and environmental conditions.
IOTA LSR 3100G can be used for electronic component encapsulation and protection in applications such as:
The silicone can protect circuit assemblies and electronic components against moisture, dust, vibration and environmental exposure.
The combination of electrical insulation, thermal conductivity and temperature resistance makes selected 3100G grades suitable for certain power electronic encapsulation applications.
The flexible cured silicone can provide environmental protection for sensors, control units and electronic modules.
Addition-cured silicone encapsulation can be considered for battery-related electronic assemblies where electrical insulation and moisture protection are required.
The material can be used for electronic assemblies exposed to outdoor temperature changes, moisture and vibration.
Need a white electronic encapsulant with ≥0.8 W/m·K thermal conductivity?
Consider IOTA LSR 3101G.
Need a black electronic encapsulant with ≥0.8 W/m·K thermal conductivity?
Consider IOTA LSR 3102G.
Need a grey electronic encapsulant with ≥0.8 W/m·K thermal conductivity?
Consider IOTA LSR 3103G.
Need a transparent, lower-viscosity electronic encapsulant?
Consider IOTA LSR 3100G.
Need a 1:1 addition-cured silicone system?
The IOTA LSR 3100G series uses a 1:1 Part A/Part B mixing ratio.
Need electrical insulation for electronic components?
The series provides a listed volume resistivity of ≥10¹⁴ Ω·cm and breakdown voltage of ≥20 kV/mm.
IOTA LSR 3100G is a two-component addition-cured RTV-2 silicone rubber designed for electronic encapsulation, potting, coating and protection.
The mixing ratio is 1:1 for Part A and Part B, by weight or volume.
Yes. The product series is designed for protecting electronic components and assemblies against moisture, vibration, dust, chemicals and temperature changes.
Depending on the specific grade, viscosity is approximately 1,000–2,000 mPa·s.
The listed operating temperature range is -50°C to 250°C.
Yes. The listed volume resistivity is ≥10¹⁴ Ω·cm, and the listed breakdown voltage is ≥20 kV/mm.
IOTA LSR 3100G is the transparent formulation. It has a viscosity of approximately 1,000–1,500 mPa·s and a hardness of approximately Shore A 25–30.
The listed 3101G, 3102G and 3103G grades have an IPX6 waterproof level.
Depending on the specific model, the listed curing time is approximately 4–10 hours.
IOTA LSR 3100G is an addition-cured silicone encapsulant with a 1:1 mixing ratio, while IOTA LSR 3300G is a condensation-cured silicone encapsulant that uses a different curing chemistry and mixing ratio.
The appropriate product should be selected according to the required curing system, processing conditions, electrical requirements and environmental conditions.
