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IOTA LSR 3300G is a two-component liquid silicone rubber used for electronic encapsulation and potting.
The material is mixed at a 10:1 ratio of Part A to Part B and cures into a flexible silicone rubber. Depending on the model, the uncured material has a viscosity of approximately 2,000–4,000 mPa·s, while the cured silicone provides electrical insulation and protection against environmental exposure.
The product is suitable for electronic components and assemblies that require protection from:
Moisture
Water
Dust
Vibration
Mechanical shock
Ozone
Chemicals
Temperature variation
The IOTA LSR 3300G series combines electrical insulation, thermal resistance and environmental protection in a flexible silicone encapsulation system.
Key specifications include:
| Property | Typical Value |
|---|---|
| Mixing Ratio | 10:1 |
| Viscosity | 2,000–4,000 mPa·s |
| Working Time | 30–60 minutes |
| Curing Time | 4–10 hours |
| Hardness | Shore A 15±2 to 30±2 |
| Volume Resistivity | ≥10¹⁴ Ω·cm |
| Breakdown Voltage | ≥20 kV/mm |
| Dielectric Constant | 2.7–3.3 |
| Dielectric Loss | ≤0.02 |
| Operating Temperature | -50°C to 250°C |
| Thermal Conductivity | ≥0.2–0.8 W/m·K |
| Available Colors | Black, White, Grey and Transparent |
The above values are based on laboratory testing at 25°C and may vary according to the specific model and application conditions.
The 3300G series includes several formulations for different electronic encapsulation requirements.
| Model | Color | Viscosity | Hardness | Adhesive | Thermal Conductivity | Waterproof Level |
|---|---|---|---|---|---|---|
| 3304G | Black | 4000±500 mPa·s | Shore A 30±2 | No | ≥0.8 W/m·K | IPX6 |
| 3411G | Black | 4000±500 mPa·s | Shore A 30±2 | Yes | ≥0.8 W/m·K | IPX8 |
| 3301G | White | 4000±500 mPa·s | Shore A 30±2 | No | ≥0.8 W/m·K | IPX6 |
| 3311G | White | 4000±500 mPa·s | Shore A 30±2 | Yes | ≥0.8 W/m·K | IPX8 |
| 3303G | Grey | 4000±500 mPa·s | Shore A 30±2 | No | ≥0.8 W/m·K | IPX6 |
| 3300G | Transparent | 2000–3000 mPa·s | Shore A 15±2 | Yes | ≥0.2 W/m·K | IPX4 |
These non-adhesive formulations are suitable when the encapsulation material is primarily required to provide environmental protection and electrical insulation without strong bonding to the electronic component.
These adhesive formulations are designed for applications where the silicone needs to bond to electronic components or assemblies. Both models provide an IPX8 waterproof level according to the listed product specifications.
3300G is the transparent formulation of the series. It has a lower viscosity of 2,000–3,000 mPa·s and a softer hardness of Shore A 15±2, making it suitable for applications where transparency, flexibility and lower-viscosity processing are important.
IOTA LSR 3300G series is designed for electrical insulation and protection of electronic assemblies.
The listed electrical properties include:
Volume resistivity: ≥10¹⁴ Ω·cm
Breakdown voltage: ≥20 kV/mm
Dielectric constant: 2.7–3.3
Dielectric loss: ≤0.02
These properties make the material suitable for protecting electronic components where electrical insulation and environmental protection are required.
The IOTA LSR 3300G series has a listed operating temperature range of -50°C to 250°C.
This temperature range allows the silicone encapsulant to be considered for electronic assemblies exposed to significant temperature variation.
For production applications, the final material selection should be validated against the actual operating temperature, component temperature, curing conditions and long-term environmental requirements.
Different models in the 3300G series provide different waterproof levels.
The listed waterproof ratings are:
IPX8: 3411G and 3311G
IPX6: 3304G, 3301G and 3303G
IPX4: 3300G
Therefore, the appropriate model should be selected according to the required environmental protection level of the electronic assembly.
IOTA LSR 3300G condensation-cured silicone encapsulant can be used for protecting:
Electronic components
Electronic control assemblies
Sensors
Electrical modules
Circuit assemblies
Power and control components
Outdoor electronic assemblies
Components requiring moisture and vibration protection
The encapsulant forms a flexible silicone layer around the protected component, helping isolate it from moisture, dust, vibration and other environmental conditions.
Mix Part A and Part B at a 10:1 ratio by weight or volume.
Thoroughly scrape the sides and bottom of the mixing container during mixing to ensure uniformity.
Vacuum degassing is recommended after mixing to remove entrapped air from the liquid silicone.
For best results, dispense the mixed silicone from the lowest point of the encapsulation area and allow the material to flow naturally.
A uniform filling process helps reduce air entrapment.
Automatic dispensing equipment can be used for production applications.
The listed curing time varies by model.
Most 3300G series products have a room-temperature curing time of approximately 4–10 hours, while the transparent 3300G formulation is listed at approximately 8–10 hours.
Curing speed depends on temperature and processing conditions. Higher temperatures generally accelerate curing, while lower temperatures slow the curing process.
The model should be selected according to the application's primary requirements.
Choose 3411G or 3311G when adhesive bonding and IPX8-level waterproof protection are important.
Choose 3304G, 3301G or 3303G when a non-adhesive encapsulation system with ≥0.8 W/m·K thermal conductivity is required.
Choose 3300G when transparency, lower viscosity and softer cured silicone are important.
For applications requiring thermal management, electrical insulation or waterproof protection, the complete specification should be evaluated rather than selecting a silicone solely accordi
