In the field of electronic manufacturing, every precision component requires a solid defense line to resist the erosion of the external environment. Electronic sealing adhesive, as the core material of this defense line, is becoming an indispensable "invisible guardian" of the electronics industry with its excellent performance and wide application fields.

Electronic sealing adhesive is a protective material designed specifically for electronic components. Before curing, it appears as a liquid resin composite with fluidity, which can easily penetrate into every corner of the component. Once cured, it forms a dense and tough protective layer, providing comprehensive protection for electronic components. Whether it is waterproof, moisture-proof, dust-proof, corrosion-resistant, or resistant to high and low temperature impacts, electronic sealant can demonstrate its excellent performance.

According to different application requirements, electronic sealing adhesives are divided into various types, each with its unique advantages. Epoxy resin sealant is known for its high hardness and strong adhesion, making it suitable for applications that require high mechanical strength; Organic silicone sealant has become the preferred choice for high-end equipment such as new energy vehicles and 5G base stations due to its excellent weather resistance and electrical insulation properties; Polyurethane sealant is widely used in high-power power modules and solar junction boxes due to its outstanding low-temperature resistance and good adhesion. In addition, there is a sealing adhesive specifically used for LED chips, which has high transmittance and low viscosity, and can effectively improve the luminous flux and lifespan of LEDs.

When choosing electronic sealant, multiple factors need to be considered comprehensively. In addition to performance requirements, attention should also be paid to the sealing process and cost-effectiveness. For example, in situations where rapid curing is required, electronic potting adhesives that can be cured at room temperature or by heating can be chosen; For components with complex structures, low viscosity and high fluidity electronic potting adhesives are a better choice. Meanwhile, with the increasingly strict environmental regulations, halogen-free and low VOC emission electronic sealing adhesives are gradually becoming the mainstream in the market.

Regarding electronic potting silicone rubber, please refer to the details:
IOTA Silicone Encapsulating Rubber 33 series (Condensation Cured)
IOTA Silicone Encapsulating Rubber 13 series (Addition Cured)