Silicone glass resin and high temperature resistant silicone mica binder

China's earliest development of silicone glass resin and high-temperature mica binder is Huo Changshun and Chen Yufeng of Chenguang Research Institute of Chemical Industry. In the late 1970s, CTS-103 silicone resin, commonly known as "silicone glass resin", was successfully prepared by hydrolysis and polycondensation of monomethyltriethoxysilane in the presence of an acidic catalyst. This resin was used early in the processing of fine paper, as well as coating protection on metal surfaces, and also for the bonding of mica or mica powder. In 1980, Shanghai Sanhua, Xue Zhiqing and Li Yansheng used solid cation exchange resins as temporary acidic catalysts. Fang Sanhua uses monomethyltriethoxysilane; Xue Zhiqing and Li Yansheng use monomethyltriethoxysilane to add a small amount of dimethyldiethoxysilane to synthesize SAR-1 and SAR-2 transparent and wear resistant. Silicone. Since the resin has no residual inorganic acid, the storage property of the product is very stable, and no cementation is found after one year. Since SAR-2 introduces a small amount of difunctional raw materials, the product is soft and soft, and has a wider application range. It can be widely used in glass, plastic, metal and other materials; it is especially suitable for the protection of transparent plastics such as polycarbonate, polystyrene and polyvinyl chloride, and as a moisture-proof insulating protective coating for electronic components, which will soon be produced on a large scale.

From 1980 to 1982, Chen Hongqiu, Li Yan, and Cui Zuomin of Chenguang Chemical Research Institute; from 1981 to 1983, Shanghai Resin Factory Xu Zhihong and Xue Zhiqing used monomethyltrichlorosilane as the main raw material to prepare silicone high temperature mica binder. Product grades are MR-30 and SAR-8. In addition to the high temperature resistance, electrical insulation, moisture resistance and waterproof properties of general silicone products, the products have high adhesion and flame retardant properties. It is mainly used for the manufacture of high temperature resistant powder mica boards and tube insulation in household appliances, high temperature resistant powder mica boards for support, and mica boards for internal welding of electric welding machines. Various heat-resistant pigments may be added as a smokeless anticorrosive paint, and a non-combustible molding compound or a ceramic molding resin may be used as a glass fiber composite laminate and silica. China has abundant mica powder resources and can be developed into a series of high temperature resistant insulating mica board products.

Shanghai Resin Factory SAR-8, SAR-9 adopts its own process characteristic route: hydrolyze and alcoholize the organic silicon monomer while concentrating and polycondensing. SAR-8, SAR-9 was put into production in 1983, and the output has reached nearly 1,000 tons. The main raw material of this product is monomethyltrichlorosilane, so whether it is producing MR-30 or SAR-8, SAR-9 can greatly increase the use value of monomethyltrichlorosilane.

Silicone molding compound

In the 1960s, China's aviation industry urgently needed an arc-resistant silicone molding compound for microswitches capable of withstanding high current and high voltage. The Beijing Research Institute of Chemical Industry has successfully developed a silicone resin directly hydrolyzed with monomethyltrichlorosilane as a raw material, and is made of asbestos-filled material to form an arc-resistant molding compound, which solves the urgent need of the aviation industry. This material was transferred to the Shanghai Resin Factory for production. After the demand is not much, Shanghai Resin Factory no longer produces, but users still need this material, they have to relocate to Sichuan Chenguang Chemical Research Institute for help. In order to meet the urgent needs of users, Wu Shengquan of the institute has used a hydrolysis condensation route from monomethyltriethoxysilane as a starting material to prepare silicone resin for molding plastics with satisfactory performance, which solves the urgent need of users.

Silicone resin encapsulant

In the late 1960s, with the development of China's electronics industry, it is necessary to use high-insulation, high-temperature, moisture-proof, non-combustible silicone encapsulants to package large and small power diodes, transistors, resistors. , capacitors, integrated circuits and other electronic devices. Earlier in China, the development of such resins was carried out by Zhang Xinghua and He Jigang of the Institute of Chemistry of the Chinese Academy of Sciences, as well as Zhang Jikai and Li Yansheng of Shanghai Resin Factory. The various products they developed filled the domestic gap.

Silicone resin modified coating

Most of the general silicone resins are composed of polymethylsiloxane and polyphenylsiloxane. The phenyl group-containing silicone resin is more compatible with the organic resin than the methyl silicone resin. The introduction of a phenyl group-containing silicone resin into a general coating can improve the temperature resistance and water resistance of a general coating. In the coatings industry, phenyl-containing silicone resins can be blended or copolymerized to produce high performance silicone-containing coatings. As early as the 1960s, Tianjin Paint Factory and Shanghai Resin Factory developed a coating of silicone-modified synthetic resin. Developed a variety of high-performance varieties, such as silicone-modified epoxy resin with good heat resistance and good bonding properties.
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