Advantages of epoxy resin electronic potting glue:

Most of the epoxy resin potting glue is hard after curing, of course, some modified epoxy resin potting glue is soft after curing. The obvious advantages of epoxy resin potting glue are that it has good adhesion to the material and good insulation, and the cured product has good acid and alkali resistance. Epoxy encapsulant usually has a temperature resistance of 100 degrees Celsius. If the epoxy resin electronic potting compound of transparent material is used, it has better light transmittance.

Disadvantages of epoxy resin electronic potting glue:

1. The epoxy resin potting glue has weak resistance to cold and heat changes, and cracks are likely to occur after severe cold and heat shocks, which will allow water vapor to enter through the cracks and corrode the circuit;

2. After the epoxy resin potting glue is cured, the colloidal hardness is high and brittle, and it is easy to strain electronic components due to high mechanical stress;

3. Once the epoxy resin electronic potting glue is potted and cured, it is not easy to disassemble due to its high hardness. If a component is damaged inside, it can only be replaced as a whole;

4. The weather resistance of epoxy resin potting glue materials for transparency is generally not very good, and it is easy to produce yellowing phenomenon under light or high temperature conditions