In the electronics manufacturing industry, silicone potting glue is very common. After heating and curing, it can form a relatively strong elastomer and form a certain degree of protection for electronic components. However, in actual use, sometimes the potting glue cannot be cured. It is called the "poisoning" phenomenon of silicone potting compound. There are several reasons for the "poisoning" phenomenon of silicone potting glue:

(1) Glue AB component ratio is wrong: In actual use, usually the ratio of A component and B component is 1:1 or 10:1 (depending on TDS), if there is a large error in the ratio , The glue may not solidify. The solution is to strictly follow the TDS to carry out the ratio.

(2) Improper or expired glue storage: The glue storage environment is inappropriate or expired, the catalyst contained in the glue may become invalid, which will cause the glue to not solidify. The solution is to store in strict accordance with the storage conditions of the glue and use it before the expiration date.

(3) Contact with organic compounds such as P, S, N and ionic compounds containing alkynes and polyvinyl compounds or Sn, Pb, Hg, As and other elements during use. The above substances will interact with the adhesive in the adhesive. The catalyst reacted and the glue could not be cured. When this happens, according to the author's personal experience, simply adding a catalyst cannot completely solve the problem of curing the "poisoned" glue again. Under normal circumstances, it is necessary to remove the uncured glue, thoroughly clean the sizing part, and apply the glue again for better curing. The whole process is relatively time-consuming and may not solve the problem quickly. Therefore, in the use of potting silica gel, special attention must be paid to the items that may come into contact with the glue must not contain the above "harmful" substances. For example, during the production process, solder and S-containing rubber gloves (finger cots) are strictly prohibited from contacting the silicone potting compound.