Epoxy resin has a high refractive index and light transmittance, and its mechanical properties and bonding properties are quite good, so there are still certain products in the market. By introducing the silicone functional group to modify the epoxy resin, the high temperature performance and impact resistance of the epoxy resin can be improved, the shrinkage rate and thermal expansion of the product can be reduced, and the application range of the product can be increased. According to the reaction mechanism, silicone modified epoxy resin can be divided into two methods: physical blending and chemical copolymerization. If purely relying on pure physical blending, due to the large difference between the solubility coefficients of silicone and epoxy resin, the microscopic phase structure is likely to be in a separated state, and the modification effect is not good. Generally, it needs to be improved by adding a transitional compatible group. Its compatible performance.

The organic silicon polymer is based on the Si-O bond as the main chain, and organic groups are connected to the silicon atoms. There can be R3 SiO1 /2( M), R3 SiO2 /2( D), R3 SiO3 /2( T), R3 SiO2( Q) The chain links are combined according to a certain ratio; the Si-O bond energy is higher, which makes it have better high temperature resistance or radiation performance, and the Si-O bond angle is larger, which can make the molecular chain of the material soft . Silicone materials have excellent properties in terms of heat resistance and yellowing resistance. Organic silicon materials are easy to modify, and functional groups that can increase the refractive index, such as sulfur, benzene, phenol, and epoxy groups, can be introduced into the side chain to increase the refractive index of the packaging material and improve the luminous efficiency of the LED.