Electronic adhesive products and applications

There are many types of electronic adhesive products, including EVA hot melt adhesive, organic silicone, epoxy adhesive, UV adhesive, PUR adhesive, conductive adhesive, instant dry adhesive, polyurethane adhesive, anaerobic adhesive and so on. Among them, silica gel, EVA hot melt adhesive, PUR glue production is the most, other electronic glue product production is relatively small. Including all kinds of insulation materials, shielding, EMI materials, shockproof products, heat insulation materials, adhesive products, dustproof material products, sponge products and other special materials, suitable for electronics, electrical appliances, toys, lighting, telecommunications, machinery and other manufacturers.

RTV silicone rubber or silicone gel used in the sealing of electronic and electrical components, can play the role of moisture-proof, dustproof, corrosion prevention, shockproof, improve the performance and stability parameters, and it is liquid before vulcanization, easy to perfusion, easy to use. Application of silicone gel encapsulation, no release of low molecules, no stress contraction, deep vulcanization, no corrosion, after vulcanization into transparent elastomer, the components encapsulated in the rubber layer clearly visible, can be used to needle into the inside one by one to measure component parameters, easy to detect and repair. The surface protection of general electronic components is coated with RTV silicone rubber, with molding silicone gel for inner coating. Among the electronic adhesives, the yield of silicone rubber accounted for about 38.7%.

EVA hot melt adhesive is a copolymer of ethylene and vinyl acetate. It is a thermosetting hot melt adhesive, which is widely used in the packaging of solar cell modules. After bonding with glass, it can improve the transmittance of glass, play the role of anti-reflection, and have a gain effect on the power output of solar cell module. Among them, EVA hot melt adhesive in the production of electronic glue accounted for about 31.0%.

Development direction and challenge of electronic adhesive industry

The multiple functions of adhesive are one of the important signs of the progress of glue industry, such as the realization of the connection of material resources at the same time, but also to achieve the role of electricity. Here, it also includes electricity that replaces the function of solder and electricity that implements grounding (grounding) function. Solder is the traditional way to connect the wire, so that it can realize the conduction of the connection, but its deficiency is often relatively large solder joints, high space, in the case of electronic components are becoming thinner and thinner, the use is limited. In addition, its connection depends on high temperature melting, so the product has to withstand high temperature process, for those components or products that can not withstand high temperature, there is no hair to achieve. Therefore, conductive adhesive can replace solder, that is, to overcome its shortcomings, and realize the dual role of connection and conduction. Of course, conductive adhesive can be divided into heating curing, room temperature curing and even UV curing type conductive adhesive introduced by Panacol company. Even if it is heated curing, the curing temperature of general conductive adhesive will not exceed 150℃. In recent years, low temperature curing conductive adhesive has even appeared on the market, whose heating temperature does not exceed 80℃, which makes the application of conductive adhesive more widely. Generally speaking, for conductive adhesive with grounding function, it often requires high bonding fastness and fast curing speed, because its conductive particle content is not high, so the cost will be relatively low. At present, cost is an important factor restricting the promotion of conductive adhesive. How to develop conductive adhesive with low resistivity, low cost and high bonding strength is the direction of the suppliers' efforts.