In the electronic industry, humidity, salt fog and mold are the main factors affecting the normal operation of electronic appliances, among which humidity is the most common and important factor. The equipment runs in a humid environment, no matter what kind of material, the surface of the component will form a layer of water film, CO2, SO2, NO2 and other gases in the atmosphere will enter the water film to form an electrolyte, and then cause the insulation strength of the insulation material to reduce and the electrochemical corrosion of metal materials.

Among them, the destruction of insulation strength is often in the case of material surface heat or vibration caused by cracking, water vapor into the crack occurs, at a very low voltage will also discharge, resulting in the breakdown of insulation material. Even if the surface of the material is complete without cracking, when the water vapor in the environment reaches saturation, the thickness of the water film on the surface of the material can reach dozens of microns, and the resistance of the material surface will still be significantly reduced, and the insulation effect will decrease accordingly.

In metal materials, with the increase of environmental humidity, exposed metal is corroded, resistance increases, resulting in local heat rise, serious will occur circuit short circuit or even burn equipment. In addition, the humid environment is also conducive to the growth and reproduction of mold, mold in the process of growth and metabolism, will secrete acidic substances on the surface of the attached material, causing corrosion of the equipment, reduce the accuracy of the instrument and instrument failure, and greatly affect the overall appearance of the equipment.

In high humidity areas, electrical equipment must have a perfect moisture-proof design to ensure its normal operation. Generally, the main moisture-proof measures for electronic and electrical equipment are:

1. Use waterproof and mildew proof materials. Electronic equipment is made of materials with low moisture absorption, such as stainless steel, aluminum alloy and some plastic waterproof materials.
2. Dry. Use desiccant or drying device to improve the use of the environment.
3. Waterproof treatment of electronic devices by spraying, impregnating, sealing and detesting water.
Take our most common and effective potting and sealing process for example, the potting and sealing process is the electronic potting glue through mechanical or manual way into the electronic panel and circuit components, after its curing to form excellent polymer materials, play a role of bonding, sealing and moisture-proof. In addition, the pouring sealant has excellent insulation, thermal performance, can improve the security of electronic equipment, when the electronic equipment in the case of long running a local overheating, thermal conductivity, through pouring sealant can effectively will electronic panels and circuit element heat transfer to the outside world, ensure the equipment can work at a lower temperature.

At present, most electronic products on the market choose silicone potting adhesive, polyurethane potting adhesive and epoxy potting adhesive. Users can choose appropriate potting adhesive according to their own product characteristics.