Common Silicone Rubber Base "Thermal Conductive Interface Material"
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Silicone rubber is a linear polymer material. The main chain is composed of silicon and oxygen bonds with strong bond energy. It has the advantages of excellent light resistance, aging resistance, dielectric property, corrosion resistance, mildew resistance and excellent chemical stability. Because of these comprehensive properties, silicone rubber is widely used in "thermal interface materials". However, the thermal conductivity of pure silicone rubber products is low, its thermal conductivity is about 0.168W/(m· K), and it is difficult to meet the needs of users when directly applied to the "thermal interface material". In order to improve its thermal conductivity and broaden its application in the field of electronics, the most commonly used method is to disperse the filling material with high thermal conductivity coefficient into the silicone rubber matrix to form sufficient thermal conductivity chain similar to the network structure, so as to improve the thermal conductivity of the silicone rubber base "thermal conductivity interface material".
1. "Thermal conductive interface material" based on alkyl silicone oil
With hydroxyl silicone oil as the substrate "thermal interface materials commonly used thermal conductive silicone or silicone paste products, its with dimethyl silicone oil, methyl phenyl silicone oil or long chain alkyl silicone oil, such as hydroxyl silicone oil as base oil, through mechanical mixing thermal conductivity of compound or metal powder (such as aluminum oxide, zinc oxide, boron nitride, aluminum powder, copper powder or silver powder, etc.) made from as thickening agent products. This kind of products have good stereotypes at any time, no flow, high thermal conductivity, no curing, no corrosion of interface materials and other characteristics, is widely used in electronic equipment, electrical equipment, communication equipment, power module and other fields, to solve the problem of heat conduction and heat dissipation between electronic components and heat sink plate or heat sink plate. Its main product performance indicators are thermal conductivity, oil separation, coning degree, etc.
2. "Thermal conductive interface material" with hydroxyl silicone oil as matrix
Hydroxyl silicone oil for matrix condensation type "thermal interface materials" normally with alpha, omega - dihydroxy polydimethylsiloxane based polymer, under the condition of high temperature vacuum mixing high thermal conductivity filler masterbatch was prepared, complete, and the crosslinking agent, catalyst and other characteristics of additives on the moisture of scattered high speed mixer mixing. The products are usually packaged in sealed tubes or hoses, and the packaged products are divided into single component, two component, or even multi-component. When used, the extruded product is paste and solidified by cross-linking reaction with water molecules and releasing small molecule substances. Common condensation "heat conduction interface materials" include heat conduction flame retardant adhesive, heat conduction bonding adhesive, heat conduction sealing adhesive and other products, which are widely used in solar photovoltaic, automobile, computer, mobile phone, new energy and other electronic and electrical fields to ensure the safe, stable and reliable operation of electronic components when working. Its main product properties are conventional properties (such as surface dryness, thin consistency, etc.), mechanical properties (such as tensile strength, elongation, etc.), electrical properties (such as volume resistivity, dielectric strength, etc.) and thermal conductivity.
3. "Thermal conductive interface material" with vinyl silicone oil as matrix
The "thermal conductivity interface material" which is formed with vinyl silicone oil as the matrix is composed of polyorganosiloxane containing vinyl as the base polymer, thermal conductivity powder as the filling material, hydrogen silicone oil as the crosslinking agent and other special components as the auxiliary agent. The reaction principle is that under the catalysis of the eighth group transition metal compound (such as Pt, etc.), hydrogen silicon addition reaction is carried out with multi-Si-H bond polysiloxane to form a new Si-C bond, so that the linear siloxane forms a network structure. After the completion of the reaction, the cross linking is formed into an elastomer. In the reaction process, this kind of silicon rubber based "thermal conductive interface material" has the characteristics of no by-products, small shrinkage, high conversion rate, easy to control the crosslinking rate, and no corrosion on the contact substrate. The products are divided into two categories: one component and two components according to the packaging form, and the two components are in the majority in the market. Common products include silicone thermal conductivity potting glue, silicone gel and other products, mainly used in automotive, consumer electronics, cable accessories and other electronic components and circuit board insulation potting, play a good role in sealing protection, shock absorption, heat dissipation and other functions.