The heat resistance of phenyl rubber is one of its most significant advantages, which makes it unique among many polymer materials, especially exhibiting excellent performance in high temperature environments.

Heat resistance refers to the ability of a material to maintain its physical and chemical stability under high temperature conditions. For phenyl rubber, its heat resistance is mainly reflected in the following aspects:

Firstly, phenyl rubber can maintain structural stability at high temperatures. In high-temperature environments, many ordinary polymer materials are prone to thermal decomposition or degradation, leading to a decrease in performance. However, due to its unique molecular structure and chemical bonding method, phenyl gum can maintain the integrity and stability of its molecular chain at high temperatures, thereby avoiding thermal decomposition. This structural stability enables phenyl rubber to maintain good mechanical properties and chemical stability at high temperatures.

Secondly, phenyl rubber has excellent thermal aging properties. Thermal aging refers to the phenomenon where the performance of a material gradually decreases after prolonged exposure to high temperatures. For phenyl rubber, due to the presence of stable structural units such as benzene rings in its molecular chain, these structural units can effectively resist oxidation and degradation at high temperatures, thereby delaying the process of thermal aging. Therefore, phenyl rubber can maintain a longer service life at high temperatures, reducing the risk of performance degradation and failure caused by thermal aging.

In addition, phenyl rubber also has good thermal conductivity and coefficient of thermal expansion. Thermal conductivity refers to the ability of a material to conduct heat, while the coefficient of thermal expansion reflects the degree of size change of the material when temperature changes. The thermal conductivity of phenyl rubber is moderate, which can effectively transfer heat and avoid local overheating; At the same time, its coefficient of thermal expansion is also low, which can maintain dimensional stability at high temperatures, avoiding dimensional changes and performance degradation caused by thermal expansion.

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