When AI meets thermally conductive potting compound, this two-way rush is overwhelming!
 
Nowadays, AI is nothing new, from smart speakers that can chat to robots that flexibly help with work, they are like intimate assistants, making life super convenient.
 
But you know what? While these smart devices are running at a rapid pace, a cooling problem is lurking. Take smart speakers as an example, when you have a hot chat with it, let it tell jokes, play music, or intelligent robots are analyzing images and planning action routes, the chips inside them are like small motors running at high speed, working at full strength and continuously generating heat. If the heat can't be dissipated, the device will be like a patient with a fever, with greatly reduced performance, sluggish response, and may even "strike".
 
At this time, the thermally conductive potting compound shines in! It's like a low-key behind-the-scenes hero, silently performing "cooling magic". Once it enters the AI device, it quickly fits tightly with the heat-generating chip, and then uses its unique thermal conductivity ability to "grab" the heat tightly, and then transmits it as quickly as possible to cool down the device.
 
With the protection of thermal conductive encapsulant, the smart speaker can always respond sensitively to your every command, and the music played is also clear and beautiful; Intelligent robots can also respond flexibly in complex environments and complete tasks efficiently. Thermally conductive potting glue keeps AI devices "awake" at all times and continues to add color to our smart life!

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