The correct potting method can greatly extend the service life of electronic components! Potting compound is a kind of liquid silicone rubber with fluidity. It is liquid before curing. The material, performance and production process of the product lead to the difference between the viscosity of the glue. The potting compound is completely cured to form a soft rubbery shape, which has the characteristics of heat resistance, moisture resistance, cold resistance and impact resistance.
There are two types of potting glue: manual filling and machine filling. Generally, the molding is mostly machine filling. There are three ways to use the potting glue. Let's take a look!
method one:
Single-component potting gels can be used for grabbing or direct perfusion.
Method Two:
After the condensation type potting compound and the curing agent are thoroughly stirred, the air bubble is treated by a vacuum machine, and then directly poured. The ratio of silica gel to curing agent is 100:2 or 100:3.
Method three
   Compared with the first two, the addition of molding potting glue requires attention to the following points:
1. Keep the potting products dry and clean;
2. The addition molding potting compound has AB two-component, check whether the A component silica gel has sedimentation, and stir evenly;
3. After mixing the AB components, stir them evenly to prevent the silicone from appearing.
4. It is best to control the amount of glue in the filling process. Too much amount will accelerate the curing speed, shorten the operation time, and release a lot of heat during the curing process. Therefore, the glue after mixing Try to use up the liquid in a short time!
5. After the infusion, the glue will slowly penetrate into the gap of the product, and secondary infusion should be carried out if necessary;
6. During the curing process, keep the surrounding environment clean and avoid the uncured potting compound being doped with impurities or dust.
Additive potting compound can be cured at room temperature or warmed. It has good moisture-proof and waterproof effect. It is suitable for high-power LED electronic products, street lamp power supply, power module, circuit board potting and power line bonding.