Potting is an important application field of epoxy resin. It has been widely used in electronic device manufacturing and is an indispensable important insulating material for the electronics industry.


Potting is the process of filling a liquid epoxy resin composite into a device equipped with electronic components and wires by mechanical or manual means, and curing at room temperature or under heating to become a thermosetting polymer insulating material with excellent performance.


Its function is to strengthen the integrity of electronic devices, improve the resistance to external shocks and vibrations; improve the insulation between internal components and circuits, which is beneficial to miniaturization and light weight of devices; avoid direct exposure of components and circuits, and improve waterproofing of devices. , moisture resistance.


Epoxy potting compound has a wide range of applications, and the technical requirements vary widely. There are two types of curing conditions: room temperature curing and heat curing. There are two types of two components and one component from the dosage form. Multi-component dosage forms are rare because they are inconvenient to use. According to the coating online, the room temperature curing epoxy potting compound is generally two-component, and can be cured without heating after potting, which is not required for equipment and is convenient to use. The disadvantage is that the composite has large viscosity, poor impregnation, short pot life, and is difficult to achieve automatic production, and the heat resistance and electrical properties of the cured product are not high. Generally used for low-voltage electronic device potting or not suitable for heat curing.


Heat curing two-component epoxy potting compound is the most widely used and widely used variety. The utility model has the advantages that the viscosity of the composite work is small, the processability is good, the application period is long, the impregnation property is good, the comprehensive performance of the cured product is excellent, and the single component epoxy potting material is suitable for the automatic production line of the high-voltage electronic device, which is developed abroad in recent years. New varieties need to be cured by heat. Compared with the two-component heat curing potting compound, the outstanding advantage is that the required potting equipment is simple and convenient to use, and the quality of the potting glue has little dependence on equipment and process.


Insufficient is the higher cost, strict material storage conditions, the epoxy potting compound used should meet the following requirements:


1, good performance, long application period, suitable for large-volume automatic production line operations.


2, the viscosity is small, strong impregnation, can be filled with components and lines.


3. During the potting and solidification process, the powder components such as fillers are small in sedimentation and do not delaminate.


4. The curing exothermic peak is low and the curing shrinkage is small.


5, the electrical properties and mechanical properties of the cured product is excellent, heat resistance, good adhesion to a variety of materials, water absorption and coefficient of linear expansion.


6. In some occasions, the potting material is required to have properties such as flame retardancy, weather resistance, heat conduction, high and low temperature resistance.