Effect of curing temperature on the molding of silica gel products
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Vulcanization temperature is generally understood as the temperature required for the cross-linking reaction between molecules in the silica gel raw material, that is, the temperature required for the silica gel to change from a raw material without a fixed shape to a silica gel product with a fixed shape. The vulcanization temperature has a considerable impact on the molding of silica gel products, which directly affects the production efficiency and quality of products. If the control is not good, the following problems are likely to occur.
1γ Problems easily occur when the curing temperature of silica gel products is too high
Too high curing temperature can easily lead to defects such as lack of glue, small size, thick thickness, deformation, numbness, brittleness, easy to crack, and difficult to remove edges. For silicone keys, it is also easy to cause high load. Another interesting phenomenon is that when the vulcanization temperature is too high, it is easy to have air blast.
2γ Problems easily occur when the curing temperature of silica gel products is too low
The problems caused by the low curing temperature are basically the opposite to the high curing temperature. It is easy to cause the silicone products to be small in size, thin in thickness, incomplete vulcanization, soft and other defects. For the silicone keys, it is also easy to cause the low load, black particles falling off and other defects. However, there are also several points similar to the high curing temperature, such as the difficulty of edge removal and air wrapping.
Conclusion: The curing temperature of silica gel products should be set in a reasonable range. Too high or too low will affect the quality of silica gel products during molding, so it must be strictly controlled during production. The IPQC of the silicone product manufacturer should also be equipped with a meter to measure the mold temperature of each machine on time. If there is any abnormality, it should be improved immediately to minimize the defects caused by the curing temperature.