1.Polyurethane potting compound

The temperature requirement is not more than 100 degrees Celsius. There are many bubbles after encapsulation. The encapsulation conditions are under vacuum, and the adhesion is between epoxy and silicone.

advantage:

Excellent low temperature performance and shock resistance is the best of the three.

Disadvantages:

The high temperature resistance is poor, the surface of the colloid is not smooth and the toughness is poor after curing, the aging resistance and ultraviolet resistance are weak, and the colloid is easy to discolor.

Scope of application:

Suitable for potting indoor electrical components with low heat generation.

Second, epoxy potting

advantage:

It has excellent high temperature resistance and electrical insulation ability, simple operation, very stable before and after curing, and excellent adhesion to a variety of metal substrates and porous substrates.

Disadvantages:

The resistance to cold and heat changes is weak, and cracks easily occur after being subjected to cold and heat shocks, which causes water vapor to penetrate into the electronic components from the cracks, and the moisture resistance is poor. And after curing, the colloid has high hardness and brittleness, which is easy to damage the electronic components.

Scope of application:

Suitable for potting electronic components under normal temperature conditions without special requirements for environmental mechanical properties.