Phenyl Silicone gum（RTV）;Dihydroxy Poly Dimethyl Diphenyl Siloxane

2.Molecular Formula: (CH3)2SiOH[(C6H5)2SiO]m[(CH3)2SiO]nOH

3.Structure:


4.Specifications:


5.Application:

This product in addition to the good electrical properties, corrosion resistance, ozone resistance, also has good resistance to low temperature performance of irradiation, self-extinguishing and ablation resistance. Can be used for a variety of original electronic potting materials, and materials for dipping impression and stripping, a component of binder. At minus 120 ℃ under the condition of low temperature remains resilient, available for special purposes.

6.Package & Transportation:

N. W. 25KGS/Plastic drum, transported and stored as non-dangerous goods, avoid sun and rain exposure, isolated from fire, away from heat source. Over the storage period 3 years should review, if qualified can use.