Encapsulation is an important application area of epoxy resin, which has been widely used in electronic device manufacturing and is an indispensable important insulating material for the electronics industry.

Encapsulation is to mechanically or manually fill a liquid epoxy resin compound into a device equipped with electronic components and circuits, and cure under normal temperature or heating conditions to become a thermosetting polymer insulation material with excellent performance.

Its role is to strengthen the integrity of electronic devices and increase resistance to external shocks and vibrations; improve the internal component and circuit insulation, which is conducive to device miniaturization and light weight; avoid direct exposure of components and circuits, and improve the waterproofing of devices And moisture resistance.

Epoxy potting glue has a wide range of applications, technical requirements vary widely, and there are many varieties. There are two types of curing conditions: room temperature curing and heat curing. There are two types of components: two-component and single-component. Multi-component dosage forms are rare as commodities due to inconvenience in use. According to the online understanding of coating, room temperature curing epoxy potting compound is generally two-component, and it can be cured without heating after potting. It does not require high equipment and is easy to use. The disadvantages are that the compound has large operating viscosity, poor infiltration, short pot life, difficult to realize automated production, and the heat resistance and electrical properties of the cured product are not very high. Generally used for low-voltage electronic device potting or occasions where heat curing is not suitable.

Heat curing two-component epoxy encapsulant is the most widely used variety. Its characteristics are that the compound has low operating viscosity, good processability, long pot life, good infiltration properties, and excellent comprehensive properties of cured products. It is suitable for high-voltage electronic device automatic production lines using single-component epoxy potting materials. New varieties need to be cured by heating. Compared with the two-component heat curing potting compound, the outstanding advantages are that the required potting equipment is simple and easy to use, and the quality of the potting compound is less dependent on the equipment and process.

In addition to the disadvantages are higher costs and strict requirements for material storage conditions. The epoxy potting compound used should meet the following requirements:

1. Good performance, long service life, suitable for large-volume automatic production line operations.

2, small viscosity, strong infiltration, can fill the components and lines.

3. During the potting and curing process, powder components such as fillers have little sedimentation and do not delaminate.

4. Low curing exothermic peak and small curing shrinkage.

5. Excellent electrical and mechanical properties of the cured product. Good heat resistance, good adhesion to a variety of materials, small water absorption and low coefficient of linear expansion.

6. In some occasions, the potting material is required to have properties such as flame resistance, weather resistance, thermal conductivity, high and low temperature resistance.