Electronic potting adhesive is a liquid glue infused on electronic component parts, which can provide excellent heat dissipation and flame retardant performance for electronic components, and can also effectively improve the shock resistance and moisture resistance of electronic components, ensuring electronic components Use stability. So what are the performance requirements for an electronic potting compound suitable for electronic components?
1. Strong electrical insulation ability, can effectively improve the insulation between internal components and lines after potting;

2. It has water-repellent performance, and can improve the moisture-proof performance of electronic components after potting;

3. It has excellent thermal conductivity and can effectively improve the heat dissipation ability of electronic products after potting;

4, with excellent weather resistance and salt spray resistance, to ensure that electronic components are not affected by the natural environment;

5. Colloid has no corrosive effect on electronic components;

6. Even after the colloid is cured, it will not deform.

7, strong resistance to cold and heat changes, even if subjected to cold and heat changes between -60 ℃ ~ 200 ℃, the colloid can still remain elastic and not crack;


8. It can be cured at room temperature or heated;